发明名称 SUBSTRATE-HOLDING MECHANISM AND SUBSTRATE-CONVEYING APPARATUS WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To attain a high throughput of a substrate conveying apparatus, and to reduce the weight of a substrate-holding mechanism. SOLUTION: The substrate-holding mechanism includes a slide arm 2 having a plurality of pads 8, 9, 10, and 11 on which a substrate 1 can be placed; a fixing arm 3 which supports the slide arm 2 so that it is slidable between an extended position and a contracted position; and a pusher 12, fixed to the fixing arm 3 which does not come into contact with the substrate 1, when the slide arm 2 is in the extended position, and is brought into contact with the circumference edge of the substrate 1, when the slide arm 2 is in the contracted position. When the slide arm is in the contracted position, the substrate 1 is held by the plurality of pad 10 and 11 and the pusher 12. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011171347(A) 申请公布日期 2011.09.01
申请号 JP20100031121 申请日期 2010.02.16
申请人 YASKAWA ELECTRIC CORP 发明人 SHINPO HIROKI;FURUICHI MASATOSHI
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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