发明名称 SUBSTRATE WORKING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate working apparatus exactly processible of two parallel scribe lines having a narrow width for forming a terminal area in a short time. SOLUTION: This invention relates to the substrate working apparatus for working a substrate by rolling cutter wheels along the respective two parallel scribe scheduled lines for forming the terminal area of a mother substrate, wherein the cutter wheels 30, 30 are supported by cutter holders 30a, 30a, a scanning mechanism for scanning the cutter holders in the direction of the scribe scheduled lines is provided, and shift mechanisms 13 for shifting the cutter wheels by a distance smaller than 10 mm in the direction vertical to the scribe scheduled lines are attached to the cutter holder. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011162395(A) 申请公布日期 2011.08.25
申请号 JP20100026880 申请日期 2010.02.09
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 NISHIO JINKO;EDA TATSUO
分类号 C03B33/033;B28D1/24;B28D5/00 主分类号 C03B33/033
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