发明名称 Cutting segment, method for manufacturing cutting segment, and cutting tool comprising the same
摘要 A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
申请公布号 US8002858(B2) 申请公布日期 2011.08.23
申请号 US20060911510 申请日期 2006.04.14
申请人 EHWA DIAMOND INDUSTRIAL CO., LTD.;GENERAL TOOL, INC. 发明人 KIM SOO-KWANG;PARK HEE-DONG
分类号 B24B7/00;B28D1/00 主分类号 B24B7/00
代理机构 代理人
主权项
地址