| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method which can stably form a desired plating film, and an electroplating apparatus. SOLUTION: The electroplating apparatus 2 incudes: a cathode 20 connected to a conductive layer 12; a plurality of anodes 21 arranged along the carrying direction of a base material 1 and further separately arranged; a carrying means carrying the base material 1 while making the other side of the insulating layer 11 of the base material 1 face the anode 21; and an electroplating liquid feeding part 23 flowing electroplating to a space between the other side of the insulating layer 11 of the base material 1 and each anode 21. The electroplating liquid L is made to flow between the other side of the insulating layer 11 and the anode 21 by the electroplating feeding part 23 in the electroplating apparatus, and further, the electroplating liquid L between the other side of the insulating layer 11 and the anode 21 is exhausted to the part lower than the other side of the insulating layer 11. Further, the electroplating apparatus 2 includes a control part controlling the amount of the electric current flowing between each anode 21 and the cathode 20. COPYRIGHT: (C)2011,JPO&INPIT
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