发明名称 CONDUCTIVE PAD AND METHOD FOR MANUFACTURING CONDUCTIVE PAD
摘要 PURPOSE: A conductive pad and a method for manufacturing the conductive pad are provided to enhance ground properties by securing flexibility and high electricity while securing a thin film structure. CONSTITUTION: A conductive pad comprises a sheet compressing a foam sponge(20) and a plating layer(30) coated on the sheet. The conductive pad comprises further nonwoven fabric attached to at least one side of the sheet. The conductive pad includes a resin layer coated on the surface of the sheet. The conductive pad has the structure where nickel, copper and nickel are electroless plated. A method for preparing the conductive pad comprises the steps of: preparing a thin film sheet by compressing foam urethane raw fabrics; and plating metals on the sheet.
申请公布号 KR20110088779(A) 申请公布日期 2011.08.04
申请号 KR20100008447 申请日期 2010.01.29
申请人 E-SONG EMC CO., LTD. 发明人 SONG, JUN GU
分类号 B32B5/18;B32B15/14;B32B27/12 主分类号 B32B5/18
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