ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC COMPONENT PACKAGE MANUFACTURING METHOD

摘要

Disclosed is an electronic component package 100 including a circuit board 10, an electronic component 20, and an adhesive layer 30. The circuit board 10 is provided with an electrically-conductive conductor post 16 which is buried in a base member 12, and a solder layer 18 which is provided at the front end 13 of the conductor post 16 while exposed from a surface 121 of the base member 12. An electrode pad 24 having a metal layer 22 mounted thereon is provided on the main surface 26 of the electronic component 20. The adhesive layer 30 contains a flux activating compound, and bonds the surface 121 of the base member 12 and the main surface 26 of the electronic component 20. Then, the metal layer 22 and the solder layer 18 are metal-bonded.