发明名称 |
ROOM TEMPERATURE DIRECT METAL-METAL BONDING |
摘要 |
A method for forming direct metal-metal bond between metallic surfaces is disclosed. The method comprises depositing a first nanostructured organic coating (118) on a first metallic surface (116) to form a first passivation layer thereon, the first nanostructured organic coating (118) comprising an organic phase with nanoparticles dispersed within the organic phase, contacting the first nanostructured organic coating (118) with a second metallic surface (126), and applying on the first and second metallic surfaces (116, 126) at least a bonding temperature of at least room temperature and/or a bonding pressure for a bonding period to bond the first and second metallic surfaces (116, 126) thereby forming the direct metal-metal bond therebetween. A second nanostructured organic coating (128) comprising an organic phase with nanoparticles dispersed within the organic phase may also be deposited on the second metallic surface (126). |
申请公布号 |
SG171839(A1) |
申请公布日期 |
2011.07.28 |
申请号 |
SG20110038569 |
申请日期 |
2008.11.27 |
申请人 |
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH;NANYANG TECHNOLOGICAL UNIVERSITY |
发明人 |
WEI, JUN;ANG, XIAO FANG;WONG, CHEE CHEONG;CHEN, ZHONG |
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