发明名称 ROOM TEMPERATURE DIRECT METAL-METAL BONDING
摘要 A method for forming direct metal-metal bond between metallic surfaces is disclosed. The method comprises depositing a first nanostructured organic coating (118) on a first metallic surface (116) to form a first passivation layer thereon, the first nanostructured organic coating (118) comprising an organic phase with nanoparticles dispersed within the organic phase, contacting the first nanostructured organic coating (118) with a second metallic surface (126), and applying on the first and second metallic surfaces (116, 126) at least a bonding temperature of at least room temperature and/or a bonding pressure for a bonding period to bond the first and second metallic surfaces (116, 126) thereby forming the direct metal-metal bond therebetween. A second nanostructured organic coating (128) comprising an organic phase with nanoparticles dispersed within the organic phase may also be deposited on the second metallic surface (126).
申请公布号 SG171839(A1) 申请公布日期 2011.07.28
申请号 SG20110038569 申请日期 2008.11.27
申请人 AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH;NANYANG TECHNOLOGICAL UNIVERSITY 发明人 WEI, JUN;ANG, XIAO FANG;WONG, CHEE CHEONG;CHEN, ZHONG
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