ELEMENT MOUNTING SUBSTRATE, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE, AND PORTABLE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an element mounting substrate which is improved in connection reliability with a connecting member such as solder.

SOLUTION: The semiconductor module 10 has a PoP structure in which an electrode area 148 of a first wiring layer 140 provided on a first element mounting substrate 110 constituting a first semiconductor module 100 and a fourth wiring layer 242 provided on a second semiconductor module 200 are joined together by a solder ball 270. A first insulating layer 150 having an opening for exposing a drawing area of the first wiring layer 140 is provided on one main surface of an insulating resin layer 130, and a second insulating layer 152 is provided on the first insulating layer 150 so as to expose the opening of the first insulating layer. The opening diameter of the opening at a lower surface portion of the second insulating layer 152 is larger than the opening diameter of the opening at an upper surface portion of the first insulating layer 150.

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