| 发明名称 |
Ball Grid Array Package Enhanced With a Thermal and Electrical Connector |
| 摘要 |
A package is provided. The package includes a substrate having first and second surfaces, a stiffener coupled to the first surface of the substrate, and a thermal connector coupled to the second surface of the substrate that is configured to be coupled to a printed circuit board.
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| 申请公布号 |
US2011140272(A1) |
申请公布日期 |
2011.06.16 |
| 申请号 |
US201113030950 |
申请日期 |
2011.02.18 |
| 申请人 |
BROADCOM CORPORATION |
发明人 |
ZHAO SAM ZIQUN;KHAN REZA-UR RAHMAN |
| 分类号 |
H01L23/485;H01L23/36;H01L23/367;H01L23/373;H01L23/433;H01L23/498 |
主分类号 |
H01L23/485 |
| 代理机构 |
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代理人 |
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| 主权项 |
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