发明名称 |
Light emitting device and fabrication method thereof |
摘要 |
Disclosed herein is a light emitting device with improved life characteristics. The light emitting device comprises a circuit board having a recess, a reflection plane and an excitation source disposed in the recess, an overmolding overlying the reflection plane and the excitation source, a surface-inducing film formed on the overmolding, and a light conversion layer overlying the surface-inducing film. Also disclosed herein is a method for fabricating the light emitting device.
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申请公布号 |
US7957434(B2) |
申请公布日期 |
2011.06.07 |
申请号 |
US20080289948 |
申请日期 |
2008.11.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG EUN JOO;JUN SHIN AE;JANG HYO SOOK;LIM JUNG EUN |
分类号 |
H01S3/10;H01L33/48;H01L33/50;H01L33/56;H01L33/60 |
主分类号 |
H01S3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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