发明名称 ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING CONNECTION ASSEMBLY USING THE SAME
摘要 An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film (2) is composes of an insulating adhesive resin containing polybutadiene particles, a cationic polymerizable resin and a cationic curing agent, and conductive particles dispersed in the insulating adhesive resin, with the lowest melt viscosity of the anisotropic conductive film being 300 to 1000 Pa·s. This anisotropic conductive film is placed in contact with terminal electrodes of a glass substrate (1). A flexible printed circuit board (3) is placed on top of the anisotropic conductive film so that terminal electrodes of the flexible printed circuit board (3) are in contact with the anisotropic conductive film (2). A heating tool is thrust onto the flexible printed circuit board side for electrically interconnecting the terminal electrodes.
申请公布号 US2011120767(A1) 申请公布日期 2011.05.26
申请号 US20080674987 申请日期 2008.05.20
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 SATO DAISUKE;OZEKI HIROKI;ISHIMATSU TOMOYUKI
分类号 H01B1/12;H01R4/04;H05K13/00 主分类号 H01B1/12
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