Lead-free solder paste for surface mounting,申请号PL20090389510-传众专利搜索

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发明名称	Lead-free solder paste for surface mounting
摘要
申请公布号	PL389510(A1)	申请公布日期	2011.05.23
申请号	PL20090389510	申请日期	2009.11.09
申请人	INSTYTUT TELE- I RADIOTECHNICZNY	发明人	BUKAT KRYSTYNA;KO&SACUTE,CIELSKI MAREK;SITEK JANUSZ;KAROLEWSKI SEBASTIAN;RAFALIK IRENEUSZ;WOCH MIECZYS&LSTROK,AW
分类号	B23K35/363;B23K35/26;H05K3/34	主分类号	B23K35/363
代理机构		代理人
主权项
地址

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