发明名称 PACKAGING MATERIAL FOR MOLDING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a packaging material for molding, having excellent forming property which is not subjected to pin holes or cracks even if the material is subjected to the deep-drawing forming, the stretch forming or the like with a large forming height. <P>SOLUTION: The packaging material 1 for forming includes a heat-resistant resin layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 arranged between these layers. A biaxially stretched polypropylene film layer 5 is laminated and disposed between the thermoplastic resin layer 3 and the metal foil layer 4. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011098759(A) 申请公布日期 2011.05.19
申请号 JP20090254873 申请日期 2009.11.06
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 KURAMOTO AKINOBU;NANBORI YUJI
分类号 B65D65/40;B32B15/085;B65D1/00;H01M2/02 主分类号 B65D65/40
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