发明名称 Encapsulation resins
摘要 Curable polyorganosiloxanes are provided that cure in the absence of a hydrosilylation catalyst. The cured polyorganosiloxanes have increased stability and can be used as encapsulation resin is at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency. in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and do not generate cracks and peeling even in use over a long period of time.
申请公布号 US7943719(B2) 申请公布日期 2011.05.17
申请号 US20080072853 申请日期 2008.02.28
申请人 THE REGENTS OF THE UNIVERSITY OF CALIFORNIA,;MITSUBISHI CHEMICAL COMPANY 发明人 HAWKER CRAIG J.;GUINO ROSETTE G.;SEKI KEIICHI;TAKIZAWA KENICHI;MOTI YUTAKA
分类号 C08G77/12 主分类号 C08G77/12
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