METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE

摘要

A tape separation mechanism suction-holds a chip into which a substrate is diced that is adhesively held on a mount frame via a protective tape, and moves to place the chip in a mounting position of the substrate on a substrate holding stage. A heater heats via a head the protective tape joined to a surface of the chip at the mounting position that loses its adhesive force due to foam and expansion through heating. Thereafter, the tape separation mechanism moves upward while suction-holding the protective tape, thereby separating and removing the protective tape from the chip.