| 摘要 |
PROBLEM TO BE SOLVED: To provide resin containing solder which prevents a solder diameter from becoming unstable because of a groove or cut provided in the solder, while preventing a solder deposit from being scattered by deposit expansion due to the evaporation of flux caused by heating at the time of soldering, and which is suitable to improve the winding operation of solder and the handling of resin containing solder after the winding up. SOLUTION: In the resin containing solder with flux 2 built in, a continuous cut is made up to the depth long enough to reach the flux 2 along the axial direction of the solder and, after that, the cut is closed. The cut may be made up to the depth long enough not to reach the flux. COPYRIGHT: (C)2011,JPO&INPIT
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