| 摘要 |
A semiconductor chip includes a plurality of electrode terminals having a fixed terminal which is supplied with a signal, an outside terminal for the signal being fixed when the semiconductor chip is mounted in both a face-up configuration and a face-down configuration on a package substrate that has the outside terminal, and which is arranged within 50% of the width of the semiconductor chip with a symmetric line of the semiconductor chip as a center. According to the present invention, it is possible to reduce the variation of the wiring delays of the fixed terminal and to keep the wiring routes from being complicated, when the semiconductor chip is mounted in both the face-up configuration and the face-down configuration.
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