| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermocompression head, which prevents a wiring board from being deformed, even when applying hot-pressing with a pressure over a wide range, to a mounting region having a height difference. <P>SOLUTION: The thermocompression head 1 bonds a pressure-bonding component 10 to a bonding area via a thermosetting bonding agent 17, by hot-pressing the pressure-bonding component via a buffering material 20. In the head has a pressing surface 2 for pressing the pressure-bonding component 10 to the bonding area, a recessed part 3 prepared in the pressing surface 2 according to a portion to be pressed with a low pressure in the pressure bonding component 10 and the bonding area, and a projection part 4, which is erected at a height lower than a depth of the recessed part 3 inside the recessed part 3, and presses the pressure-bonding component 10 via the buffering material 20. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
