发明名称 |
Compliant penetrating packaging interconnect |
摘要 |
A circuit package is provided. The circuit package includes a plurality of electrically conductive pads located on a bottom surface of the circuit package, wherein at least one pad of the plurality of bottom surface pads has a recession for receiving an electrically conductive protrusion located on a substrate to which the circuit package is to be mounted.
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申请公布号 |
US7897878(B2) |
申请公布日期 |
2011.03.01 |
申请号 |
US20070627430 |
申请日期 |
2007.01.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COTEUS PAUL;HOUGHAM GARETH GEOFFREY;SUNDLOF BRIAN R. |
分类号 |
H05K1/11;H05K3/36 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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