| 摘要 |
PURPOSE: A method for manufacturing a light emitting diode chip with fluorescent liquid and the light emitting diode chip are provided to reduce time required for manufacturing the light emitting diode chip by applying the fluorescent liquid on the upper side of a wafer and dividing the wafer into sector units. CONSTITUTION: Pads(20) are formed on each sector on a semiconductor wafer(10). A first groove(11) with a pre-set depth is formed on the upper side of the wafer along the boundary of each sector unit. Fluorescent liquid is applied on the pad and the first groove. The wafer is divided into light emitting diode chip units. The fluorescent liquid is applied to the cut side(10a) of the wafer. An electric connection terminal pillar(21) is formed on each pad. The fluorescent liquid is applied to the electric connection terminal pillar, and the upper side of the electric connection terminal pillar is exposed.
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