发明名称 |
LEADFRAME, METHOD FOR MANUFACTURING THE LEADFRAME, AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE LEADFRAME |
摘要 |
A lead frame comprises on a same plane, a pad part including an LED chip mounting upper surface A on which at least an LED chip is to be mounted, and a lead part including an electric connection area C in which an electric connection with the LED chip is made. A relationship between an area S1 of the mounting upper surface of the pad part 2 and an area S2 of a radiating lower surface opposite to the mounting upper surface is represented by 0<S1<S2. Side surfaces of the pad part between the mounting upper surface and the radiating lower surface are provided with stepped parts or tapered parts which spread in a direction from the mounting upper surface toward the radiating lower surface and hold a resin-filled during molding. |
申请公布号 |
KR20110016966(A) |
申请公布日期 |
2011.02.18 |
申请号 |
KR20107029799 |
申请日期 |
2009.11.05 |
申请人 |
TOPPAN PRINTING CO., LTD. |
发明人 |
YOSHIOKA OSAMU;MOTOMURA HITOSHI;TSUKAMOTO TAKEHITO |
分类号 |
H01L33/62;H01L23/495;H01L33/64 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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