| 摘要 |
PURPOSE: A wafer sampling apparatus and a wafer sampling method using the same are provided to accurately implement the sampling work regardless of crystal forming direction of the wafer by forming the scratch using the diamond tip on the particular portion of the inspection target wafer. CONSTITUTION: An inspection object wafer(W) is settled on a wafer fixing bottom plate(10). A wafer fixing top plate(20) is fixed and coupled to the wafer fixing lower plate. A rotating ruler(30) is installed to be rotating around the center of the wafer fixing top plate. A diamond tip(40) forms the scratch on the edge part of the wafer.
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