发明名称 ADHESIVE MATERIAL REEL
摘要 <p>The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region.</p>
申请公布号 KR20110015599(A) 申请公布日期 2011.02.16
申请号 KR20107027375 申请日期 2010.02.24
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TATSUZAWA TAKASHI;SEKI TAKASHI;KOBAYASHI KOUJI;FUJINAWA TOHRU;ARIFUKU MOTOHIRO;SEKI KOTARO
分类号 H01R11/01;C09J7/02;H05K1/14 主分类号 H01R11/01
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