发明名称 |
MOLD CLEANING SHEET AND METHOD OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME |
摘要 |
A cleaning sheet (29) is formed with a trough-hole (29a) at a portion corresponding to a cavity of a mold along with a slit (29b) or a flow cavity cut (29c) at every corner at an outer periphery of the through-hole (29a) and is placed between a first mold half and a second mold half of the mold to clean the inside of the mold, thereby improving the cleaning effect of the mold. |
申请公布号 |
US2011033984(A1) |
申请公布日期 |
2011.02.10 |
申请号 |
US20100906421 |
申请日期 |
2010.10.18 |
申请人 |
RENESAS ELECTRONICS CORPORATION;HITACHI YONEZAWA ELECTRONICS CO., LTD. |
发明人 |
TSUCHIDA KIYOSHI |
分类号 |
H01L21/56;B29C33/72;B29C45/14;B29C45/17 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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