| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered fluoroplastic substrate superior in the adhesiveness of an insulating layer (fluoroplastic layer, polyimide resin layer) and an inorganic substrate even in severe environment such as high temperature and high humidity environment or the like and superior in heat resistance, fire retardancy, dimensional stability, electric characteristics and reliability.SOLUTION: The multilayered fluoroplastic film is constituted by laminating the fluoroplastic layer (A), the polyimide resin layer (B) and the fluoroplastic layer (A) in this order and the coefficient of linear expansion of the multilayered fluoroplastic film and the thickness ratio of the layer (A) are set to a predetermined range. |
