发明名称 |
Integrated circuit package system with external interconnects within a die platform |
摘要 |
The present invention provides an integrated circuit package system comprising: attaching a die platform to an integrated circuit die; mounting the integrated circuit die over an external interconnect with a bottom side of the external interconnect partially within the die platform; connecting the integrated circuit die and the external interconnect; and forming an encapsulation over the integrated circuit die with the external interconnect partially exposed.
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申请公布号 |
US7863102(B2) |
申请公布日期 |
2011.01.04 |
申请号 |
US20080036056 |
申请日期 |
2008.02.22 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
TAY LIONEL CHIEN HUI;CHOW SENG GUAN |
分类号 |
H01L21/00;H01L29/93 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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