发明名称 |
FABRICATION METHOD FOR SYSTEM-ON-CHIP (SOC) MODULE |
摘要 |
A fabrication method for a system-on-chip (SoC) module is provided. The fabrication method includes the steps of providing at least two SoC sub-modules and connecting the SoC sub-modules. The SoC sub-modules are electrically connected with each other by connection interfaces of the SoC sub-modules so as to form the SoC module. As the SoC sub-modules have been verified in advance, the time required for verifying the resulting SoC module can be significantly reduced. As for application-specific SoC modules, they are fabricated by connecting with application-specific SoC sub-modules via the appropriate connection interfaces. Thus, the time and costs for developing SoC modules can both be minimized.
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申请公布号 |
US2010330741(A1) |
申请公布日期 |
2010.12.30 |
申请号 |
US20090570049 |
申请日期 |
2009.09.30 |
申请人 |
NATIONAL CHIP IMPLEMENTATION CENTER NATIONAL APPLIED RESEARCH LABORATORIES. |
发明人 |
HUANG CHUN-MING;WU CHIEN-MING;YANG CHIH-CHYAU;CHEN SHIH-LUN;WEY CHIN-LONG;CHEN CHI-SHI;LIN CHI-SHENG |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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