THIN SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE SUPPORT AND METHODS OF MAKING THE SAME
摘要
Ultra-thin semiconductor devices, including piezo-resistive sensing elements can be formed a wafer stack that facilitates handling many thin device dice at a wafer level. Three embodiments are provided to form the thin dice in a wafer stack using three different fabrication techniques that include anodic bonding, adhesive bonding and fusion bonding. A trench is etched around each thin die to separate the thin die from others in the wafer stack. A tether layer, also known as a tether, is used to hold thin dice or dice in a wafer stack. Such as wafer stack holds many thin dice together at a wafer level for handling and enables easier die picking in packaging processes.
申请公布号
WO2010138267(A2)
申请公布日期
2010.12.02
申请号
WO2010US32709
申请日期
2010.04.28
申请人
CONTINENTAL AUTOMOTIVE SYSTEMS, INC.;DING, XIAOYI;FRYE, JEFFREY;MILLER, GREGORY, A.