| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus wherein a semiconductor chip mounting body improved in impact resistance of a thermosetting resin corresponding to a corner part of a semiconductor chip is mounted in a housing, and which has high reliability. <P>SOLUTION: This electronic apparatus includes: a housing; a circuit board housed in the housing; a semiconductor chip mounted on the circuit board; a thermosetting resin arranged between the circuit board and the semiconductor chip for bonding the circuit board and the semiconductor chip to each other; and magnetic material powder existing in the part of the thermosetting resin corresponding to a corner part of the semiconductor chip at high density relative to those of regions other than the part. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
