HEAT SINK, HEAT SINK COVER, ELECTRONIC MODULE, ELECTRONIC SUBSTRATE, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To sufficiently cool an electronic component intended to be cooled by a heat sink even when a fin direction of a plate fin type heat sink is not set parallel to the direction of cooling air in terms of a device structure, and cooling performance of the plate fin type heat sink can not be sufficiently exhibited, in a forced-air-cooled electronic apparatus. SOLUTION: This forced-air-cooled electronic apparatus is structured such that a straightening member is mounted to an exhaust subsequent stage-side fin of the plate fin type heat sink, and a cooling airflow that currently passes through the heat sink is sent in the length direction of the fin by the straightening member. COPYRIGHT: (C)2011,JPO&INPIT