| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, by which a semiconductor chip is flip-chip-mounted on a substrate easily while securing high conductivity without using mixture such as a bubble generating agent, and which improves reliability of operation and quality. <P>SOLUTION: The method of manufacturing a semiconductor device by flip-chip-mounting the semiconductor chip 3 on the substrate 2 includes: a step of forming conductive projection parts 10, 11 on at least a surface of either one of a chip electrode 3a and a substrate electrode 2a; a step of setting the semiconductor chip on the substrate to face both of the electrodes and supplying resin 4 containing conductive filler F between the substrate and semiconductor chip; a step of locally concentrating an electric filed on the projection parts by applying a voltage between both of the electrodes, attracting the conductive filler to a projection part side, and localizing between both of the electrodes while following to a facing direction of the electrodes; and a step of curing the resin and integrally fixing the semiconductor chip and substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
