发明名称 Apparatus for conditioning processing pads
摘要 Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.
申请公布号 US7828626(B2) 申请公布日期 2010.11.09
申请号 US20080248302 申请日期 2008.10.09
申请人 APPLIED MATERIALS, INC. 发明人 BUTTERFIELD PAUL D.;KO SEN-HOU
分类号 B24B53/00;B24B1/00;B24B37/04;B24B53/007;B24B53/12 主分类号 B24B53/00
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