发明名称 |
Apparatus for conditioning processing pads |
摘要 |
Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.
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申请公布号 |
US7828626(B2) |
申请公布日期 |
2010.11.09 |
申请号 |
US20080248302 |
申请日期 |
2008.10.09 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BUTTERFIELD PAUL D.;KO SEN-HOU |
分类号 |
B24B53/00;B24B1/00;B24B37/04;B24B53/007;B24B53/12 |
主分类号 |
B24B53/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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