发明名称 |
Wafer Backside Structures Having Copper Pillars |
摘要 |
An integrated circuit structure includes a semiconductor substrate having a front side and a backside, and a conductive via penetrating the semiconductor substrate. The conductive via includes a back end extending to the backside of the semiconductor substrate. A redistribution line (RDL) is on the backside of the semiconductor substrate and electrically connected to the back end of the conductive via. A passivation layer is over the RDL, with an opening in the passivation layer, wherein a portion of the RDL is exposed through the opening. A copper pillar has a portion in the opening and electrically connected to the RDL.
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申请公布号 |
US2010276787(A1) |
申请公布日期 |
2010.11.04 |
申请号 |
US20100708287 |
申请日期 |
2010.02.18 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU CHEN-HUA;HUANG HON-LIN;HSU KUO-CHING;CHEN CHEN-SHIEN |
分类号 |
H01L23/48;H01L21/3205;H01L23/498 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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