发明名称 APPLYING DEVICE AND APPLYING METHOD FOR ADHESIVE TAPE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive tape applying device for preventing deterioration in the precision of cueing a cutting section for an adhesive tape cut in a predetermined length. SOLUTION: The adhesive tape applying device comprises: a supply reel 11 on which a release tape is wound; a conveying means 20 for intermittently pulling out the release tape from the supply reel by a predetermined length for conveyance; a cutting mechanism 31 for cutting the adhesive tape applied to the release tape and pulled out by the conveying means for conveyance to a predetermined length; an applying means 47 for allowing the adhesive tape of the predetermined length cut by the cutting mechanism and positioned at an applying position to be pressed against an electronic component part standing ready at the applying position, and heated for adhesion; and a control device for controlling the drive of the applying means to cause the applying means to heat the release tape until the supply reel is replaced by a new supply reel, the adhesive tape cut by the cutting mechanism to the predetermined length with the release tape conveyed by the conveying means is positioned at the applying position. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010241565(A) 申请公布日期 2010.10.28
申请号 JP20090093199 申请日期 2009.04.07
申请人 SHIBAURA MECHATRONICS CORP 发明人 KAGEYAMA YOHEI
分类号 B65H35/07;H01L21/60 主分类号 B65H35/07
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