发明名称 CUTTING APPARATUS, LAMINATOR, CUTTING METHOD AND CUTTING PROGRAM
摘要 <P>PROBLEM TO BE SOLVED: To provide a cutting apparatus in which a laminated film can be cut with high cutting accuracy and lamination positional accuracy while continuing laminating action. Ž<P>SOLUTION: When a cutter roller (1) and an encoder (3), which are connected to a robot arm (2), measure the predetermined length from the leading end of the laminated film (20), a cutter edge is fixed at the position equivalent to the residual length to the trailing end of the laminated film by a servomotor (4) while raising the cutter roller (1). The laminated film (20) is cut by the fixed cutter edge while lowering the cutter roller (1) correspondingly to the moving speed of a substrate (21). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010208311(A) 申请公布日期 2010.09.24
申请号 JP20090089558 申请日期 2009.03.09
申请人 SHINKO ENGINEERING KK 发明人 IMAGAWA YUTAKA
分类号 B29C65/78;B65H35/08 主分类号 B29C65/78
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