| 摘要 |
PROBLEM TO BE SOLVED: To increase throughput in a semiconductor manufacturing apparatus by increasing the number of wafers produced at a single batch. SOLUTION: The semiconductor manufacturing apparatus for heating treatment by inserting a boat into a vertical furnace. The boat has a substrate to be treated, held on a wafer mounting part 44 with a holder plate 40 held in multiple steps. The holder plate 40 has: a circular ring shape formed with a predetermined circular ring width; first recesses 45 into which edges of a tweezers 12 for mounting the substrate to be treated are loosely fittable are formed on the face, where the substrate to be treated is mounted and in the opposite side to the side where the substrate to be treated is go in and out in the holder plate 40; a second recess 46, into which the base part of the tweezers 12 is loosely fitted is formed in a side where the substrate to be treated is go in and out in the holder plate 40. The edge of the wafer-mounting part 44 is projected to the center from the inside diameter of the holder plate 40. The width of the first recess 45 in a radial direction of the circular holder plate 40 is set smaller than that of the holder plate in a radial direction of the holder plate 40. COPYRIGHT: (C)2010,JPO&INPIT |
