发明名称 |
EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, INSULATING RESIN SHEET, AND PROCESS FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD |
摘要 |
Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.
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申请公布号 |
US2010227170(A1) |
申请公布日期 |
2010.09.09 |
申请号 |
US20080531308 |
申请日期 |
2008.04.09 |
申请人 |
SUMITOMO BAKELITE CO. LTD |
发明人 |
ENDO TADASUKE;TAKAHASHI AKIHITO |
分类号 |
B32B27/38;B29C65/02;C08K3/22;C08K3/34;C08K3/36;C08L63/00 |
主分类号 |
B32B27/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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