| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate joining method capable of selectively joining specific regions of substrates without being restricted by substrate materials and causing damage to circuit elements formed on the substrates. <P>SOLUTION: An activation solution L2 is injected selectively to regions where a thin resin layer 13 is formed on joint surfaces F of two substrates 10a and 10b. A fluid injection device, e.g. a known ink jet printer, is preferably used when injecting the activation solution selectively to given regions. When the activation solution like ozone water is injected to the thin resin layer, a silicone resin or a modified silicone resin forming the thin layer is oxidized (activated) by active oxygen in atom state, and modified to an adhesive layer 14 with expressed adhesion. Thereby the adhesive layer 14 with adhesiveness is formed on the joint surfaces of two substrates. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
