| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition hardly causing separation of adhesive interface and package crack even when being exposed to a severe reflow conditions, and achieving high package reliability in the package having a semiconductor chip mounted thereon. SOLUTION: The adhesive composition includes an energy ray-curable adhesive component, a photopolymerization initiator, and a thermally curable adhesive component, and characterized in a weight loss of the photopolymerization initiator at 160°C of≤7.0%. COPYRIGHT: (C)2010,JPO&INPIT |
