发明名称 |
CHEMICAL MECHANICAL POLISHING APPARATUS |
摘要 |
Provided is a chemical mechanical polishing (CMP) apparatus. The CMP apparatus may include a polishing pad including a plurality of concave regions. These concave regions may be two-dimensionally arranged in the polishing pad in a first direction and a second direction that are not perpendicular to each other and not parallel to each other. The concave regions arranged in the first direction may have a first pitch, and the concave regions arranged in the second direction may have a second pitch equal to the first pitch.
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申请公布号 |
US2010216378(A1) |
申请公布日期 |
2010.08.26 |
申请号 |
US20100701893 |
申请日期 |
2010.02.08 |
申请人 |
CHOI JAEKWANG;JEONG JIN-SU;HONG MYUNG-KI;YOON BOUN |
发明人 |
CHOI JAEKWANG;JEONG JIN-SU;HONG MYUNG-KI;YOON BOUN |
分类号 |
B24D11/00;B24B7/20;B24B53/02 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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