| 摘要 |
PURPOSE: A light-emitting diode package and its manufacturing method are provided to solve the non-uniformity of colour according to orientation angle of light by forming the fluorescent substance with uniform thickness in the LED chip surface. CONSTITUTION: A water repellency coating layer exposing a part of a substrate is formed on the substrate(100). An LED chip(120) is mounted in the top of the substrate with a water repellency coating layer not formed. A fluorescent substance(130) with volatile solvent is spread in order to cover the LED chip on the top of the substrate with the water repellency coating layer not formed. The volatile solvent is evaporated and the fluorescent substance is precipitated in the surface of the LED chip. A transparent resin(150) is formed on the fluorescent substance.
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