| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-density semiconductor module capable of appropriately sensing a temperature rising, and performing an appropriate control. <P>SOLUTION: On a lead frame 15 made of copper etc., having high thermal conductivity, a stack structure having a lower-layer chip 11 and an upper-layer chip 12 is mounted. Similarly, on the lead frame 15, a stack structure having a lower-layer chip 13 and an upper-layer chip 14 is mounted. Further, a control circuit chip 16 is mounted between those two stack structures. A temperature sensor 30 is mounted inside of upper surfaces of the lower-layer chips 11 and 13 (on the side where the control circuit chip 16 is present). A temperature sensor 30 is installed on an interconnect serving as a current path. <P>COPYRIGHT: (C)2010,JPO&INPIT |
