发明名称 INTEGRATED COMPACT LIQUID-COOLED APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an integrated compact liquid-cooled apparatus made free of occurrence of a water leak in a connection portion for a tube and evaporation of a liquid from the tube. Ž<P>SOLUTION: The compact liquid-cooled apparatus has a thrust impeller type circulating pump incorporated below a radiator 6 to reduce operation noise and to eliminate the need for a tube for connection. A heat exchanger 4 for semiconductor is fitted directly on the radiator 6 to eliminate the need for a connecting tube for the portion. A hole 2 for deairing and liquid filling is formed on the radiator 6. Thus, the circulating pump, radiator 6, and heat exchanger 4 for semiconductor element are united and then attached directly to equipment to be cooled, thereby easily structuring a liquid-cooling system. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010171284(A) 申请公布日期 2010.08.05
申请号 JP20090013732 申请日期 2009.01.25
申请人 AKIYAMA SEIZO 发明人 AKIYAMA SEIZO
分类号 H01L23/473 主分类号 H01L23/473
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