| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etching method capable of suppressing the influence of heat on a workpiece, controlling the area of light irradiating each of a plurality of etching places, and processing the plurality of etching places together at a time with one light source. Ž<P>SOLUTION: The etching method includes: a liquid arranging step of arranging an etchant Q which is chemically activated by the irradiation of light L, on the workpiece (substrate S); and a light irradiating step of irradiating an interface F between the workpiece and the etchant Q with the light. In the light irradiating step, a plurality of irradiation regions R of the interface F are irradiated with the light L by partially blocking the light L. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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