ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component package wherein more electronic component packages can be obtained from a wafer and electrodes of electronic components can be easily and electrically connected. SOLUTION: The electronic component package 1 includes an electronic component 4 where electrodes are formed, and a casing 9 formed by joining a plurality of structural components together so as to cover the electronic component, wherein the casing 9 has electric interconnects for leading the electrodes formed on the electronic component 4 out of the package 1. COPYRIGHT: (C)2010,JPO&INPIT