| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printing method for a semiconductor device which readily and surely prints a model name, or the like. <P>SOLUTION: The printing method for the semiconductor device performs printing on the surface of the semiconductor device A, including a semiconductor chip 1 and a resin package 5 covering the semiconductor chip 1, and includes a process of forming a groove part 6 on the surface of the resin package 5 and a process of filling the inside of the groove part 6 with a thermosetting resin 7 that is identifiable with respect to the resin package 5. <P>COPYRIGHT: (C)2010,JPO&INPIT |
