| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing equipment which can efficiently mount a substrate. Ž<P>SOLUTION: After respectively mounting side dummy substrates on both end sides of a board, a mounting tool 14 mounts a processing substrate between both the side dummy substrates. When a transfer method selection means 8 in an operation part 3 selects a first mounting method before the mounting tool 14 starts the mounting operation, substrate mounting operation is quickly ended without moving the side dummy substrates temporarily mounted on the predetermined positions regardless of the mounted state of the processing substrate. When the mounting method selection means 8 in the operation part 3 selects a second mounting method, the side dummy substrates temporarily mounted on the predetermined positions are moved according to the mounted state of the processing substrate, and then the side dummy substrate is arranged at an optimum position for the processing of the processing substrate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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