发明名称 CMP SLURRY COMPOSITION FOR POLISHING METAL WIRING
摘要 PURPOSE: A chemical mechanical polishing slurry composition for polishing a metal wire is provided to minimize the micro erosion generated during a polishing process. CONSTITUTION: A chemical mechanical polishing slurry composition for polishing a metal wire contains an abrasive, an oxidizer, a complexing agent, a corrosion inhibitor, and an additive. The additive is a polymer polymerized from an acrylic monomer, a sulfone monomer, a nitrile monomer, and an amide monomer, or a polymer compound containing more than to polymers.
申请公布号 KR20100080067(A) 申请公布日期 2010.07.08
申请号 KR20080138686 申请日期 2008.12.31
申请人 CHEIL INDUSTRIES INC. 发明人 LIM, GEON JA;KANG, DONG HUN;CHOI, WON YOUNG;KIM, TAE WAN;LEE, IN KYUNG
分类号 C09K3/14 主分类号 C09K3/14
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