发明名称 WAFER AUTOMATIC FEEDER
摘要 <p>PURPOSE: A wafer automatic supplying device is provided to improve the work efficiency by automatically supplying and replacing a wafer when a die feeder is operated. CONSTITUTION: A base unit comprises a base plate and a housing(200). A guide device is installed on the base plate. A feeding hole is obliquely formed in the front of the housing. A movable unit is carried back and forth with the guide device. A wafer cassette(600) is vertically loaded on the movable unit. The wafer cassette has a plurality of wafer storing parts. A wafer supply unit(700) automatically supplies a wafer stored in the wafer cassette to a die feeder.</p>
申请公布号 KR20100077635(A) 申请公布日期 2010.07.08
申请号 KR20080135642 申请日期 2008.12.29
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 LEE, SEON JAE;BAEK, CHANG HOON;KANG, KYUNG WAN;YUKIMORI YOSHIAKI;CHO, JEONG HO
分类号 H01L21/673;H01L21/677 主分类号 H01L21/673
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