<p>PURPOSE: A wafer automatic supplying device is provided to improve the work efficiency by automatically supplying and replacing a wafer when a die feeder is operated. CONSTITUTION: A base unit comprises a base plate and a housing(200). A guide device is installed on the base plate. A feeding hole is obliquely formed in the front of the housing. A movable unit is carried back and forth with the guide device. A wafer cassette(600) is vertically loaded on the movable unit. The wafer cassette has a plurality of wafer storing parts. A wafer supply unit(700) automatically supplies a wafer stored in the wafer cassette to a die feeder.</p>
申请公布号
KR20100077635(A)
申请公布日期
2010.07.08
申请号
KR20080135642
申请日期
2008.12.29
申请人
SAMSUNG TECHWIN CO., LTD.
发明人
LEE, SEON JAE;BAEK, CHANG HOON;KANG, KYUNG WAN;YUKIMORI YOSHIAKI;CHO, JEONG HO