| 摘要 |
PURPOSE: A liquid epoxy resin composition for an encapsulating semiconductor device, and the semiconductor device using thereof are provided to secure the package mold ability, the package warpage property, and the package reliability. CONSTITUTION: A liquid epoxy resin composition for an encapsulating semiconductor device contains an epoxy resin, a hardener, a curing accelerator, and an inorganic filler. The epoxy resin is either a bisphenol-based epoxy resin, or a naphthalene-based epoxy resin. The hardener is an acid anhydride-based hardener. 85~95wt% of inorganic filler is used for the total amount of the liquid epoxy resin composition.
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